Blister pack system

ABSTRACT

A blister pack system has a printed board, and the outside of the film of the blister pack has individual contact spots each assigned to a respective bag. Individual strip conductors run from each contact spot to a common conductor strip via the respective bag on the outside of the film. When a dragée is removed from a bag, the strip conductor assigned to the bag is interrupted. The printed board has perforations corresponding to the pattern of the bags and contact spots corresponding to the pattern of the contact spots of the blister pack. The contact spots of the board are directed towards the contact spots of the pack while the perforations of the board are directed towards the bags of the board. An edge area of the printed board has connecting contact spots each connected to a contact spot of the printed board via an individual strip conductor.

CROSS-REFERENCE TO RELATED APPLICATION

This is a nationalization of PCT/DE03/00179 filed Jan. 23, 2003 andpublished in German.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to a blister pack arrangement i.e.,system, having a blister pack which has pockets sealed by a foil andwhich can be inserted into a receiving part of a holding device.

2. Description of the Prior Art

From U.S. Pat. No. 4,526,474, for example, a device follows whichreminds a patient to take a pill. Therein a blister pack is set into aholding device which includes an electronics unit so that a patient canbe reminded at the right time to take a pill from the blister pack, andalong with this, the actual point in time of removing the pill can berecorded in the storage of the electronics unit and, in given cases, canbe transmitted to a central data processing device. The pulses whichdisplay the removal of a pill are generated during the interruption ofan electrical printed conductor.

For this, a printed conductor runs over each pill pocket of the blisterpack, where one end of the printed conductor is always connected to acommon printed conductor and the other end of the printed conductor isconnected to an individual printed conductor. The printed conductors aredisposed on the blister's foil sealing the individual pill pockets. Fromthe blister, the common printed conductor and the individual printedconductors run over the counter-contacts of the holding device and theirprinted conductors to the electronics unit.

From U.S. Pat. No. 4,660,991 an additional device for holding a blisterpack follows in which, instead of the foil having printed conductors andsealing the individual pill pockets, a material on which conductors areprinted and which can be printed through (for example, special paper) islaid into the holding device which is energized by the counter-contactsof the holding device.

Also, this device has an electronics unit with a timer which, at thepoint in time of the removal of a first pill from the blister pack,picks up an electrical start pulse for the activation of the timer andwhich at predetermined times sends out a tone and/or optical signal(memory function).

The device includes a carrier frame which encircles the edge areas orcorners of the blister pack at least partially and at its lower side isat least partially open so that the removal of a pill from a blisterpack contained in the carrier frame is possible.

SUMMARY OF THE INVENTION

The objective of the present invention consists of structuring a blisterpack arrangement so that a reliable recording by an electronics deviceof the removal of a pill is made possible and a so-called child safetyis ensured.

This objective is realized by a connection of a blister pack arrangementwith printed conductors and a printed circuit board with a child-safetycovering foil with the features described herein.

A particular advantage of the present invention consists of the factthat the present blister pack arrangement is structured so that theremoval of a pill by children is avoided.

This is achieved according to experience by a cover layer which isapplied to the underside of the printed circuit board. Before theremoval of a pill from the blister pack, a pull-off strip must be pulledoff of the printed circuit board's cover layer which covers thethrough-print area of a pill on the printed circuit board. Only afterpulling off of the strip can the pill be pressed out through pre-stampedareas. In so doing, the blister's printed conductor assigned to the pillis irreversibly separated, and the electronics recognizes the change instatus of the blister.

An additional significant advantage of the present invention consists ofthe fact that on insertion of a blister pack arrangement into theholding device it is ensured that the printed circuit boardautomatically falls into the correct position for plug-in connection. Anasymmetric arrangement of guide elements, preferably stampings, permitsonly a definite positioning of the blister pack arrangement in theholding device.

Incorrect recording of signals due to incorrect insertion of the blisterpack arrangement into the holding device can be reliably avoided. Thisis achieved by the fact that the electronics unit is only activated whenthe blister pack arrangement is in the correct position to contact theplug. Thereby problems can be avoided which are to be traced back toprocesses in the insertion of the blister pack arrangement into theholding device. Such processes can, after the production of anindividual electrical connection between the blister pack arrangementand the electronics unit, lead to interruptions of contact duringrelative movements between the blister pack arrangement and the holdingdevice, which could simulate the removal of a pill.

A coding of the printed circuit board by stamping, perforations,slotting, barcodes, or electronic processes, etc., makes possiblerecognition by the electronics units of which drug is held in a blister.This coding is, for example, possible by the stamping of slots on theprinted circuit board, which interrupts closed contacts of theelectronics unit or by printing of conductive contact pads whosedifferent arrangement can be assigned to a corresponding drug containedin the blister.

Advantageously, an economically reasonable production and theposition-oriented guiding together of blister and printed circuit boardare ensured. This is realized by the fact that, on the blister'scovering foil bearing the printed conductors, one or more passer marksare printed which, for example, can be read by an optical control devicethrough one or more windows of the printed circuit board.

The contact pads of the blister with printed conductors and the contactpads of the printed circuit board are connected long-term by means of aconductive adhesive. It is advantageous that through this long-termconnection a secure contacting between the blister and the printedcircuit board is ensured.

In order to optimize the bond between the blister and the printedcircuit board, the edge areas of the blister are connected to anon-conductive adhesive. Thus, an essentially permanent connectionbetween the blister and the printed circuit board is ensured.

BRIEF DESCRIPTION OF THE DRAWINGS

In the following, the invention and its developments are explained inmore detail in connection with the figures. Shown are:

FIG. 1: a blister pack of the blister pack arrangement according to theinvention seen from above,

FIG. 2: the blister pack of FIG. 1 seen from below, where the specialcourse of the common printed conductor and the individual printedconductors can be seen,

FIG. 3: a printed circuit board with printed conductors and openings forthe removal of pills seen from above,

FIGS. 4, 4 a, and 4 b: the printed circuit board of FIG. 3 seen fromabove with opened blister pack. For explanation: different features ofthe invention, where FIG. 4 a shows the blister pack arrangement beforeinsertion into the receiving part and FIG. 4 b shows the blister packarrangement after insertion into the receiving part,

FIG. 5: a printed circuit board partially provided with pull-off strips,

FIG. 6: a section through the present blister pack arrangement in thelongitudinal direction, where the printed circuit board and the actualblister pack are still not connected to one another for use,

FIG. 7: the blister pack arrangement of FIG. 6, where the blister packand the printed circuit board are connected to one another for use,

FIGS. 8 to 10: extensions of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Further scope of applicability of the present invention will becomeapparent from the detailed description given hereinafter. However, itshould be understood that the detailed description and specificexamples, while indicating preferred embodiments of the invention, aregiven by way of illustration only, since various changes andmodifications within the spirit and scope of the invention will becomeapparent to those skilled in the art from this detailed description.

The present blister pack arrangement includes generally a blister packwhich can be seen from FIGS. 1 and 2, said blister pack having severalpill basins or pockets 2 a to 2 g which are customary per se and serveto receive medicaments, in particular tablets, pills, or dragees 20, anda printed circuit board 8 (FIGS. 3 and 4). Preferably, the blister pack1 has, running in the longitudinal direction, two rows of pocketsdisposed adjacent to one another each with three pockets 2 b, 2 c, 2 dor 2 e, 2 f, 2 g, and an additional pocket 2 a disposed in the center atone end of the opposing rows. For example, on the side of the centralpocket 2 a turned away from the two rows of pockets, a largerpocket-like compartment 3 can be disposed in which a folded pack insertslip or the like can be disposed. Other pocket arrangements arepossible.

On the underside, a foil 28 sealing the pockets 2 a to 2 g and thecompartment 3 is disposed according to FIG. 2. To reinforce the blisterpack 1 a bead 4 running at least partially along the outer edge can beprovided (cf. FIG. 1).

On the foil 28, different contact pads 5 a to 5 g are disposed on theouter side according to FIG. 2, of which one contact pad is assigned toeach of the pockets 2 a to 2 g and disposed in its vicinity. From eachcontact pad 5 a to 5 g, an individual printed conductor 5 a′ to 5 g′runs on the outer side of the foil 28 over the corresponding pockets 2 ato 2 g to a common printed conductor 7, which preferably runs in thecenter between the two rows of pockets and is connected to a commoncontact pad 6. Through this arrangement, it is ensured that in theclosed state of the blister pack 1 an electrical connection from thecommon contact pad 6 exists via a printed conductor 5 a′ to 5 g′ runningover a pocket 2 a to 2 g to each of the contact pads 5 a to 5 g assignedits respective pocket 2 a to 2 g. In the case of the removal of a pillfrom a pocket, the electrical connection assigned to the pocket betweenthe common contact pad 6 and the respective contact pads 5 a to 5 g isinterrupted.

To the blister pack 1 thus structured, the aforementioned printedcircuit board 8 is assigned, which can be seen from FIGS. 3 and 4.According to the pattern of the contact pads 5 a to 5 g and 6 of theblister pack 1, the printed circuit board 8 has on one side a pattern ofindividual contact pads 9 a to 9 g and a common contact pad 10, wherethe contact pads 9 a to 9 g can be aligned to cover the same surface asthe contact pads 5 a to 5 g of the blister pack 1 and the contact pad 10can be aligned to cover the same surface as the contact pad 6 of theblister pack 1 if the underside of the blister pack 1 is laid onto thesurface of the printed circuit board 8 having the contact pads 9 a to 9g.

According to the pattern of the contact pads 2 a to 2 g and thecompartment 3 of the blister pack 1, the printed circuit board 8, whichpreferably consists of a flexible PVC material in particular, haspunched perforations 11 corresponding to the pockets 2 a to 2 g and apunched perforation 16 corresponding to the compartment 3, where saidperforations can be aligned to the pockets 2 a to 2 g or to thecompartment 3.

The printed circuit board 8 is preferably dimensioned so that itprojects over the blister pack 1 on all sides after its fastening to theblister pack 1, to be explained later.

FIG. 4, seen from above, shows the state in which the printed circuitboard 8 is fastened to the blister pack 1, where the contact pads 5 a to5 g of the blister pack 1 (cf. FIG. 2) are then electrically connectedto the corresponding contact pads 9 a to 9 g (cf. FIG. 3, 4) of theprinted circuit board 8 and the common contact pad 6 of the blister pack1 is electrically connected to the corresponding contact pad 10 of theprinted circuit board 8.

According to FIG. 6, this is achieved by the fact that the printedcircuit board 8 and the blister pack 1 are aligned to one anotheraccording to the arrangement of, preferably, conductive adhesive points19 on the contact pads 5 a to 5 d and 6 of the foil 28 of the blisterpack 1 or on the contact pads 9 a to 9 g and 10 of the printed circuitboard 8 and pressed onto one another. In so doing, electricalconnections arise between the contact pads 5 a to 5 g of the blisterpack 1 and the contact pads 9 a to 9 g of the printed circuit board 8.This state is represented in FIG. 7.

As FIG. 3 shows, individual connection contact pads 14 a to 14 g arelocated on one side, preferably an apical side, of the printed circuitboard 8 and a common contact pad 15, preferably adjacent to one anotherin a row. Each individual contact pad 14 a to 14 g is connected via anindividual printed conductor 14 to a certain contact pad 9 a and 9 g ofthe printed circuit board 8. The common contact pad 15 is connected viacommon printed conductor 17 to the common contact pad 10 of the printedcircuit board 8. Thus, there are, in the finished blister packarrangement according to FIGS. 4 and 7, electrical connections betweeneach individual contact pad 14 a to 14 g, via an individual printedconductor 14, an individual contact pad 9 a and 9 g of the printedcircuit board 8, a conductive adhesive point 19, an individual contactpad 5 a and 5 g of the blister pack 1, an individual printed conductor 5a′ to 5 g′ of the blister pack 1, the common printed conductor 7 of theblister pack 1, the common contact pad 6 of the blister pack 1, thecorresponding conductive adhesive point 19, the corresponding commoncontact pad 10 of the printed circuit board 8, and the common printedconductor 17 of the same to the common connection contact pad 15.

On the removal of a pill 20, e.g., in the removal of the pill 20disposed on the left in FIG. 7, the foil 28 and the correspondingprinted conductor 5 d are penetrated so that the correspondingelectrical connection for the display of the special pill removal isinterrupted. All the other electrical connections continue to exist.

The present blister pack arrangement is according to FIGS. 4 a and b,inserted into a schematically represented receiving part 23 of a holdingdevice not represented in more detail, where the electronics unit or anelectronics module (not represented) contained in the receiving part 23(or in the holding device) is connected via the individual connectcontacts 24 a to 24 g to the individual connection contact pads 14 a to14 g and 15 (cf. FIG. 4) of the blister pack 1.

In order to prevent, on insertion, a flow of current between the commonconnection contact pad 25 of the receiving part 23 and an individualcontact pad 24 a to 24 g of the receiving part 23 is first produced, buton further insertion of the blister pack arrangement into the receivingpart 23 once again interrupted, which would be indicated by theelectronics unit incorrectly as the removal of a pill, the printedcircuit board 8 is dimensioned shorter in the insertion direction P ofthe common contact pad 15 of the printed circuit board 8 than theindividual connection contact pads 14 a to 14 g of the printed circuitboard 8 so that any contact between the common contact pad 15 of theprinted circuit board 8 and, assigned to it, the contact pad 24 a to 24g of the receiving part 23 is only produced when secure contacts havealready been produced between the individual connection contact pads 14a to 14 g of the printed circuit board 8 and the assigned individualcontact pad 24 a to 24 g of the receiving part 23.

In order to ensure an adjustment and alignment of the blister packarrangement transverse to the insertion direction P in relation to thereceiving part 23, the printed circuit board 8 has on the apical side oneach side of its row of connection contact pads 14 a to 14 g, 15 analignment groove 13 or 13 a, where these alignment grooves 13 and 13 aare disposed asymmetrically to the longitudinal center line of theprinted circuit board 8 (cf. FIG. 4 a, 4 b). In the receiving part 23corresponding projecting parts 29 or 29 a (represented schematically)are disposed which engage in the alignment grooves 13 or 13 a if theblister pack arrangement is properly disposed in the receiving part 23.Only then can the electrical connections between the connection contactpads 14 a to 14 g, 15 and 24 a to 24 g, and 25 be produced.

It is pointed out that in the reverse manner the projecting parts can bedisposed on the blister pack arrangement and the alignment grooves canbe disposed on the receiving part 23.

Likewise, it is also conceivable to structure the connection contact pad15 corresponding to the individual connection contact pads 14 a to 14 gand instead of this to structure the common connection contact pad 25 inthe receiving part 23 shorter in the insertion direction P than theindividual connection contact pads in the receiving part 23 so that, oninsertion of the blister pack arrangement into the receiving part 23,the contact between the common connection contact pad 25 of thereceiving part 23 and the connection contact pad 15 of the printedcircuit board 8 is produced later than the contacts between theindividual contact pads 24 a to 24 g of the receiving part 23 and theindividual connection contact pads 14 a to 14 g of the printed circuitboard 8.

In the following, an additional significant feature of the presentinvention is explained.

On the underside of the printed circuit board 8, an additional coverlayer 27, preferably of material similar to paper, is applied in amanner which can be seen from FIG. 5, said cover layer assigning toevery individual pocket 2 a to 2 g, or to the compartment of the blisterpack arrangement 1, having a pull-off area 3′ or 2 a′ to 2 g′ whichcovers the edge areas of the corresponding pocket or the compartment. Onuse of the blister pack arrangement 1, the corresponding area must bepulled off before the pressing out of a pill or before the opening ofthe compartment 3.

The pull-off areas 2 a′ to 2 g′ and 3′ are connected by an adhesiveconnection to the underside of the printed circuit board 8, where it ispossible to undo said adhesive connection by the application of force,and are connected via a stamped-in line 22 to the cover layer 27.

Thereby it is achieved that small children (as a rule up to the age of42 months) will not take pills from out of a pharmaceutical container inthe course of their own play because they are, as a rule, not in theposition to grasp two different facts, namely the pulling off of thepull-off strip and the pressing out of a pill.

According to FIG. 4, 4 a,b, it is conceivable to provide slots 12running in the insertion direction in the longitudinal edges of theprinted circuit board 8 which project over the blister pack (1), saidslots engaging in the corresponding projections (not represented) of thereceiving part 23 or the holding device when the blister packarrangement reaches the correct position in the receiving part 23. Inthis way a hold, secured against unintentional pulling out, of theblister pack arrangement in the receiving part 23 is ensured.

In order to make possible a display of the current contents of theblister pack 1, the blister pack 1 can have the coding already mentionedwhich can be recorded by the electronics unit. A preferred form ofembodiment follows from FIGS. 8, 8 a, 9, 9 a, and 9 b.

In the blister pack 1 coding, grooves 26, 26 a-c are disposed in theapical side to be inserted into the receiving part 23, said codinggrooves working together with the contact springs 37, 37 a to c whichare disposed in the receiving part 23 expediently in the insertiondirection P. FIG. 9 (top) shows such a contact spring 37 seen from abovewhile FIG. 9 (bottom) shows the contact spring 37 from the side. In thereceiving part 23 the contact springs 37 according to FIGS. 9 a and 9 bare fastened to an upper printed circuit board 30 so that their contactareas abut, in the manner of a spring, a contact pad 32 of a lowerprinted circuit board 31 opposite the upper printed circuit board 30.

According to whether or not the contact springs 37, 37 a-c on insertionof the blister pack arrangement in the insertion direction P strike acoding groove 26, 26 a-c, the contact between contact spring and contactpad is interrupted or not. In this way, different statements on thecontent or the type of the blister pack 1 can be made in the case of,for example, four contact springs according to a predeterminedassignment of coding grooves, or no coding grooves, 16 and recorded ordisplayed by the electronics unit.

In connection with FIGS. 10, 10 a, and lob, a preferred process for themounting of the printed circuit board 8 on the foil 28 of the blisterpack 1 is explained. The printed circuit board 8 has for these windows33, 33 a, which are aligned in the correct fixation position to passermarks 34, 34 a, which are applied to the foil 28 of the blister pack 1.After, for example, the contact pads 5 a-g and 6 of the blister pack 1are provided with conductive, adhesive points 19, the individual blisterpacks 1 disposed in sequence in the manner of a track are traversed intheir longitudinal direction, where printed circuit boards 8, alsodisposed in sequence in the manner of a track, are brought close fromabove and finally traversed parallel to the blister packs 1 until a,preferably optical, sensing mechanism recognizes that the windows 33, 33a of a printed circuit boards 8 are aligned to the passer marks 34, 34 aof a blister pack 1. As soon as this is the case, the printed circuitboards 8 is pressed against the blister pack 1 and connected to the foil28 of the same, in particular glued.

The invention being thus described, it will be apparent that the samemay be varied in many ways. Such variations are not to be regarded as adeparture from the spirit and scope of the invention, and all suchmodifications as would be recognized by one skilled in the art areintended to be included within the scope of the following claims.

1. A blister pack system comprising: a blister pack that is insertableinto a receiving part of a holding device, the blister pack havingpockets sealed by a foil with individual contact pads disposed on anouter side of the foil and assigned to one of the pockets, and anindividual printed conductor that runs from each of the individualcontact pads on the outer side of the foil over the corresponding pocketto a common printed conductor connected to a common contact pad on theouter side of the foil, such that during removal of a pill from thepocket the individual printed conductor assigned to this pocket isinterrupted; and a printed circuit board having stamped perforationscorresponding to a pattern of the pockets of the blister pack, andindividual contact pads and a common contact pad corresponding to apattern of the individual contact pads and the common contact pad of theblister pack, each of the contact pads of the printed circuit boardbeing aligned with a respective one of the contact pads of the blisterpack, the common contact pad of the printed circuit board being alignedwith the common contact pad of the blister pack, and the stampedperforations of the printed circuit board being aligned with the pocketsof the blister pack, such that (i) the corresponding contact pads of theprinted circuit board and the contact pads of the blister pack and (ii)the common contact pad of the printed circuit board and the commoncontact pad of the blister pack are electrically connected to oneanother, the printed circuit board having in an edge area thereofindividual contact pads each connected via an individual printedconductor to an individual contact pad of the printed circuit board, anda common connection contact pad connected via a common printed conductorto the common contact pad of the printed circuit board, a connectionbetween the individual contact pads of the printed circuit board and thecorresponding individual contact pads of the blister pack, and aconnection between the common contact pad of the printed circuit boardand the common contact pad of the blister pack being produced viaconductive adhesive points.
 2. The blister pack system according toclaim 1, wherein the printed circuit board constructed of at least oneof plastic and cardboard.
 3. The blister pack system according to claim1, wherein the printed circuit board is flexible.
 4. The blister packsystem according to claim 1, wherein the blister pack has individualconnection contact pads and a common connection contact pad whichcooperate, respectively, with corresponding individual connectioncontact pads and a common connection contact pad of the receiving partof the holding device when the blister pack arrangement is inserted intothe receiving part.
 5. The blister pack system according to claim 4,wherein the individual connection contact pads and the common connectioncontact pad are disposed on an apical side of the printed circuit boardin a row transverse to an insertion direction (P).
 6. The blister packsystem according to claim 5, wherein relative to the insertion direction(P), the common connection contact pad is dimensioned shorter than theindividual connection contact pads of the printed circuit board.
 7. Theblister pack system according to claim 5, wherein relative to theinsertion direction (P), the individual connection contact pads and thecommon connection contact pad of the printed circuit board have an equallength and the common connection contact pad of the receiving part isdimensioned shorter than the individual connection contact pads of thereceiving part.
 8. The blister pack system according to claim 1,wherein, on an apical side asymmetrically to a longitudinal center lineof the blister pack system in an insertion direction (P), at least twoalignment grooves are disposed in which projecting parts of thereceiving part engage as the blister pack system is inserted into thereceiving part.
 9. The blister pack system according to claim 1,wherein, on an apical side line of the blister pack system, projectingparts are disposed asymmetrically to a longitudinal center line of theblister pack system in an insertion direction (P) which engage incorresponding engagement grooves of the receiving part as the blisterpack system is inserted into the receiving part.
 10. The blister packsystem according to claim 1, wherein the blister pack has in the edgearea a bead running over at least three sides thereof for reinforcement.11. The blister pack system according to claim 1, further comprising inthe edge area on sides opposite in an insertion direction (P), at leastone of slots and projections, into which corresponding at least one ofprojections and slots of the receiving part engage as the blister packsystem is fully inserted into the receiving part.
 12. The blister packsystem according to claim 1, wherein the printed circuit board and thereceiving part have coding devices for display by an electronic unit ofinformation relating to the blister pack.
 13. The blister pack systemaccording to claim 1, wherein piercing windows are disposed in theprinted circuit board and, for fastening the printed circuit board tothe foil of the blister pack the piercing windows are alignable topasser marks disposed on the foil.
 14. The blister pack system accordingto claim 1, wherein the blister pack is connected to the printed circuitboard in the edge area by an adhesive.
 15. The blister pack systemaccording to claim 2, wherein the plastic is a PVC.
 16. A blister packsystem comprising: a blister pack that is insertable into a receivingpart of a holding device, the blister pack having pockets sealed by afoil with individual contact pads disposed on an outer side of the foiland assigned to one of the pockets, and an individual printed conductorthat runs from each of the individual contact pads on the outer side ofthe foil over the corresponding pocket to a common printed conductorconnected to a common contact pad on the outer side of the foil, suchthat during removal of a pill from the pocket the individual printedconductor assigned to this pocket is interrupted; and a printed circuitboard having stamped perforations corresponding to a pattern of thepockets of the blister pack, and individual contact pads and a commoncontact pad corresponding to a pattern of the individual contact padsand the common contact pad of the blister pack, each of the contact padsof the printed circuit board being aligned with a respective one of thecontact pads of the blister pack, the common contact pad of the printedcircuit board being aligned with the common contact pad of the blisterpack, and the stamped perforations of the printed circuit board beingaligned with the pockets of the blister pack, such that (i) thecorresponding contact pads of the printed circuit board and the contactpads of the blister pack and (ii) the common contact pad of the printedcircuit board and the common contact pad of the blister pack areelectrically connected to one another, the printed circuit board havingin an edge area thereof individual contact pads each connected via anindividual printed conductor to an individual contact pad of the printedcircuit board, and a common connection contact pad connected via acommon printed conductor to the common contact pad of the printedcircuit board, a printed conductor-free side of the printed circuitboard having fastened thereon a cover layer with pull-off areas thepull-off areas being removable from the cover layer for the release ofthe stamped perforations of the printed circuit board which are alignedto the pockets of the blister pack.
 17. The blister pack systemaccording to claim 16, wherein the pull-off areas of the cover layer areconnected via stamped-in lines to the cover layer.
 18. The blister packsystem according to claim 16, wherein the blister pack has a compartmentfor receiving a pack insert slip and the printed circuit board has anadditional stamped perforation aligned to the compartment.
 19. Theblister pack system according to claim 18, wherein the cover layer hasan additional pull-off area assigned to the additional stampedperforation from which the cover layer is separable.
 20. A blister packsystem comprising: a blister pack that is insertable into a receivingpart of a holding device, the blister pack having pockets sealed by afoil with individual contact pads disposed on an outer side of the foiland assigned to one of the pockets, and an individual printed conductorthat runs from each of the individual contact pads on the outer side ofthe foil over the corresponding pocket to a common printed conductorconnected to a common contact pad on the outer side of the foil, suchthat during removal of a pill from the pocket the individual printedconductor assigned to this pocket is interrupted; and a printed circuitboard having stamped perforations corresponding to a pattern of thepockets of the blister pack, and individual contact pads and a commoncontact pad corresponding to a pattern of the individual contact padsand the common contact pad of the blister pack, each of the contact padsof the printed circuit board being aligned with a respective one of thecontact pads of the blister pack, the common contact pad of the printedcircuit board being aligned with the common contact pad of the blisterpack, and the stamped perforations of the printed circuit board beingaligned with the pockets of the blister pack, such that (i) thecorresponding contact pads of the printed circuit board and the contactpads of the blister pack and (ii) the common contact pad of the printedcircuit board and the common contact pad of the blister pack areelectrically connected to one another, the printed circuit board havingin an edge area thereof individual contact pads each connected via anindividual printed conductor to an individual contact pad of the printedcircuit board, and a common connection contact pad connected via acommon printed conductor to the common contact pad of the printedcircuit board, the printed circuit board and the receiving part having acoding device for display by an electronics unit of information relatingto the blister pack, the coding device including contact springsdisposed in the receiving part and coding grooves selectively disposedon the printed circuit board the contact springs being separated by theinserted printed circuit board from the assigned contact pads when thecontact springs do not encounter the coding grooves, and being connectedto the contact pads if the contact springs do encounter the codinggrooves.